Used ASM AD 830 #9254597 for sale

ASM AD 830 Die Attacher is a high-performance die-attach solution for precise placement of integrated circuit packages. It is designed for attaching low- or medium-power chips with a wide range of thin-film, flip-chip, and injection-molded packages. This equipment provides good chip-to-substrate electrical connections and coplanarity that helps reduce thermal and electrical stresses caused by uneven heating. The equipment includes an intelligent feeder, high-resolution stepper motor, and vacuum-actuated die-placement system with adjustable Z-axis for fine-tune control of die-placement position. The stepper motor is driven by a motion controller that allows for exact continuous-motion control of the pressurized die-placement unit. It is equipped with advanced micro-processor control technology that allows for parametric programming and automatic process optimization. The vacuum machine is adjustable so that the amount of vacuum applied can be precisely controlled to ensure that secure chip-to-substrate connection is achieved. ASM AD830 also includes a precision tooling device that facilitates easy loading and unloading of packages. The tooling device can also be used for manual placement of packages in cases where two chips need to be attached to one substrate. AD 830 Die Attacher is assembled in a dust- and debris-proof housing for a clean environment and a superior level of product quality. The entire tool is modular so as to be replaced or reconfigured in order to meet specific customer requirements without needing a full asset replacement. The model also includes a powerful data acquisition equipment that allows for process monitoring and control. The system is also designed to meet safety regulations and holds several certifications including CE and UL certification.