Used ASM AD 830 #9303352 for sale

ASM AD 830 is a die attacher developed by ASM Assembly Systems. This automated die attach equipment is designed to handle both flip chip and CSP die attachment applications. This machine offers a fast, reliable and efficient die attach process for a wide variety of substrates. ASM AD830 is a high-precision and cost-effective machine built to withstand daily use in the electronics assembly production line. This die attacher is able to execute multiple die attachment tasks, including flip chip die, CSP die and wafer level attachment. It employs hot bar technology for accurate and efficient die attach applications. With an operating speed of up to 600 cycles per hour, the equipment can attach chips as small as 0.1mm with a calculated pick and place repeatability less than 0.1mm. AD 830 is equipped with a 5-stage attenuator mechanism and has an adjustable nozzle height of up to 8mm. In addition, the nozzle is designed to provide both horizontal and vertical adjustment. With a user-friendly touch panel interface, operators can easily input their desired parameters and microstep settings. The die attacher uses proprietary software to provide precise alignment with no slip. Unique features such as stencil frame recognition, heat sink recognition and nozzle diagnostic functions help maximize coverage while helping to avoid costly errors. AD830 is designed for safe operation, low thermal stress and maximum yield. It is also equipped with a Bond Index Monitor system to help operators ensure quality output and provide compensation data for process improvement. This efficient die attacher, coupled with a powerful vacuum conveyor unit, helps to keep production running smoothly and quickly. The die attacher is also backed by a comprehensive parts and technical support machine.