Used ASM AD 830 #9352235 for sale
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ID: 9352235
Wafer Size: 6"-8"
Vintage: 2010
Die bonders, 6"-8"
Wafer loader, 6"
Expeder
Rotary bond head
Stack / Magazine to magazine disk
Disk dotting type
2010 vintage.
ASM AD 830 is a high-end automatic die attacher designed for the semiconductor industry. It is equipped with a fast and accurate attaching system for optimal efficiency and productivity. The device has a user-friendly control interface that makes it easy to program and adjust settings. This allows for flexibility to customize the die-attach process for each application. ASM AD830 incorporates Automatic Detach and Precision Attach technologies for precise die placement. The Automatic Detach technology allows for gap-free attaching in challenging cases, such as with chips with high circuit densities. The Precision Attach technology ensures accurate die placement, regardless of the materials or design configuration of the die. The machine is also equipped with Retractable Vacuum Chuck for precise placement of die into the die-attach station. The chuck enables the die to fit snugly within the secure workspace of the attacher. Additionally, AD 830 boasts adjustable tab grip settings, allowing for additional customization during the die-attach process. The device is engineered to specific quality control standards, ensuring that all products adhere to international quality standards. This ensures the die-attach process is consistent and reliable. The tool monitor and optimization software, which comes standard on all ASM models, further increases quality control and reliability of the attaching system. AD830 is a robust and reliable die-attach system. It is designed to accommodate a variety of semiconductor substrates, providing maximum flexibility for complete production line integration and optimal performance. The device is backed by a warranty and customer support, offering peace of mind and assurance of quality.
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