Used ASM AD 830 #9373120 for sale

ASM AD 830 die attacher is a sophisticated, state-of-the-art semiconductor chip handling equipment designed to accurately attach die onto substrates. It offers a more efficient and accurate solution to bonding the die onto the substrate than traditional manual methods. This system is able to provide superior die attach uniformity and speed with reduced variability and scrap. ASM AD830 is capable of attaching up to 630 die per minute, has a repeatability of +/- 12 micron, and a run time of up to 75,000 substrates (around 4,500,000 die) between die change prep. The unit utilizes an 8" Vacuum Chuck, which securely holds the substrates in place while they are being attached. It also features an adjustable die handling arm so that it can be used for windows or butt-type die attach. The machine also boasts several advanced features, such as the Autofeed hopper that stores and feeds the die and a Ultrasonic Sensing Head that provides die attachment feedback from the substrate for improved control and repeatability. The tool supports a variety of materials, including BGA, Al, Cu/Ni, EVA, FR-4, and other engineered materials. AD 830 die attacher also contains several safety features, such as an active communication asset with safety interlocks and fire detection systems. Additionally, it has a slew of modular components that makes changing its configuration and components quick and easy. Overall, AD830 die attacher is an ideal solution for those looking for an accurate and efficient die attach process. The high speeds and repeatability it provides ensures a high quality finished product every time. Its interchangeable modules and safety features make it an ideal solution for a wide range of different substrates and materials.