Used ASM AD 830 #9384286 for sale

ASM AD 830 is a die attacher used in the semi-conductor industry for attaching small dies to substrates. It is a fully automatic equipment, designed to minimize operator involvement and enhance overall process efficiency. ASM AD830 utilizes a die-bonding process, which includes needle-point and/or ultrasonic bonding. The system is comprised of an integrated die handler, pre-aligner, and die attach machine. It is equipped with a 3-axis working plane, allowing for precise adjustment of the die attach head in order to align the die precisely with the substrate. AD 830 offers excellent feature sensitivity. It can handle dies as small as 1mm, enabling it to attach dies to substrates with very high accuracy. The advanced die attach control software enables precision control over the die attach process, resulting in consistently excellent attachment quality. AD830 has an intuitive user-interface, which makes it easy to setup and operate. It includes a color Touch-Screen LCD, which is used to enter and control machine parameters. The machine is also equipped with an advanced teaching unit, allowing operators to easily create recipe settings for each die-attach process. In addition, ASM AD 830 offers comprehensive safety features. Its safety machine includes electrostatic discharge protection, error alerts, and password protection to prevent unauthorized use. It also has an acoustic signature technology, which helps to detect anomalies during the die attach process and alert the operator should any abnormalities be detected. Overall, ASM AD830 is an excellent solution for obtaining reliable and precise die attachments. Its precision, safety features, and ease of programming make it an ideal choice for semi-conductor manufacturers looking to improve their die attachment process.