Used ASM AD 830 #9392446 for sale

ASM AD 830 is a high-performance die attacher designed for use in the semiconductor industry. It is used to attach bonded die to a substrate and can be used for both chip-on-wafer (CoW) and chip-on-glass (CoG) applications. ASM AD830 features an advanced, three-axis motion control equipment that ensures precise placement and bonding of bonded die to the substrate. The machine can process up to 1,440 bonded die per hour, for a total throughput of 17.28 bonded die per second. AD 830 features a portless vacuum system with force sharing for precise die placement andPick-and-Place heads with active leak detection. The separate, pneumatically-actuated vacuum and force sharing systems minimize power requirements and maximize die placement precision. The machine uses a three-axis programming unit to map out placement patterns and a laser measuring machine to reduce pitch errors. AD830 is equipped with an advanced die paste station that ensures uniform die paste coverage with an adjustable force setting. The paste squeegee and spreader unit can be used to apply die paste to any feature of the substrate during application. Additionally, ASM AD 830 can be used to apply die adhesive prior to die placement, which guarantees die adhesion and prevents unwanted wafer heating. ASM AD830 is equipped with a 90KW, 5-micron pulse power supply that ensures fast and accurate pulse-to-die bond formation. The machine also features a dedicated, 6-axis robotic tool that can be used for handling and loading/unloading of bonded die. It is also compatible with an external vision asset for additional inspection capabilities. AD 830 is designed for use in chip-on-wafer (CoW) and chip-on-glass (CoG) based applications and can handle die sizes of up to 12.7mm x 12.7mm. It is designed for use in high-throughput processes and offers a compact design for easy integration into production lines. AD830 also features an intuitive touchscreen interface that enables easy access to machine settings and parameters.