Used ASM AD 830 #9395705 for sale

ASM AD 830 die attacher is an automated die attaching equipment designed to minimize operator fatigue and errors in die bonding processes. It features a compact footprint and is easy to operate, with a user-friendly interface that makes it ideal for a wide variety of attaching applications. The system features a non-contact vision sensor, enabling precise and precise placement of the die to the substrate. This helps to ensure a high yield and reduce costly rework. The die pickup mechanism has adjustable pickup force and utilizes a patented approach to ensure reliable pickup without sacrificing surface quality. ASM AD830 offers flexible process parameters, to accommodate a variety of dies and substrates. The temperature on the die head is individually adjustable, and the conveyor speed is adjustable for the attached dies. Temperature ramp curves and additional process parameters can be stored for multiple product lines for future use. The unit is equipped with a programmable logic controller, which can be used to customize process parameters. Configuration and data storage is done through a USB stick, eliminating the need to reconfigure the machine each time it is used. AD 830 offers efficient die bonding and repair processes. The machine is also capable of rapid die swap for finer pitch ICs and array dies, and has adjustable fluxer position for DIP package applications. Redundant sensor systems provide reliable safety monitoring and quality assurance. The cooling machine can also be modified for a wide range of packages and die sizes. AD830 is equipped with a reinforced housing to protect from environmental contamination, dust and particles, and ESD protection. Maintenance and calibration is simple and straightforward, allowing for maximum stability and efficiency.