Used ASM AD 830 #9400720 for sale

ASM AD 830 die attach equipment is an advanced high-performance equipment designed to attach dies to a substrate in an easy and efficient way. The system is equipped with a movable head and a pneumatic arm that allows the application of small dies - such as microwave, radio frequency and mixed-signal components - with accurate and efficient die-to-substrate bonding. The unit has a high precision die positioning and singulation machine, with a positioning accuracy of ±25 μm. Its CCD image acquisition functionality further enhances the tool's accuracy and repeatability. The asset features a pneumatic arm with two-axis robot-like shaking movement and air-flow control that accelerates processes and reduces missing part defects. The model has an 8.4" wide monitor, with a graphical user interface that allows operators to easily manage and monitor processes. Also, an automatic monitoring equipment comes with the system, allowing operators to analyse and adjust parameters and check die movement, solder displacement and quality of bonding for all processes. ASM AD830 has a range of interchangeable nozzle technologies and heated plates, on top of the standard heated pins. This enables the unit to process a wide range of dices with different shapes and sizes, from a minimum of 0.8mm up to 28.6mm. It is suitable for a wide range of materials, from ceramic to CerMark and beyond. Designed for maximum reliability and repeatability, AD 830 also provides process control and offers full traceability for all die attach process steps, ensuring the highest yield. Finally, the machine is fast and easy to install and operate, and is fully compatible with all standard ASM production materials.