Used ASM AD 830 #9400738 for sale

Manufacturer
ASM
Model
AD 830
ID: 9400738
Die bonder.
ASM AD 830 is a state-of-the-art die attacher developed by ASM Assembly Systems. It is an automated equipment that is designed to attach a variety of dies to printed circuit boards (PCBs). The system uses vision technology and vacuum to accurately place the die on the PCB. ASM AD830 is a robust, highly reliable and efficient production unit that is suitable for a wide range of applications, including the highly precise attachment of surface-mount (SMD) die. It is designed for the efficient and reliable production of high-density die-attach assemblies. AD 830 features a highly customized software that enables the machine to be easily configured for various production applications. Whatever the desired production cycle - from inspection to pick-and-place to placement of the die - the tool can be fine-tuned to meet the specific production requirements. The asset comes standard with a range of image processing algorithms to accurately detect and accurately place dies on the PCBs. The image processing algorithms are continuously optimized using feedback from a machine vision camera, providing the highest precision attaining accuracy of +/- 20 microns (0.02mm). AD830 offers high flexibility and high throughput. It is capable of handling a wide range of die types - from small 0201 sizes up to large 0813 - as well as a wide range of high-density boards. The maximum board size is 405 x 305 mm, while the maximum cycle time is 8.9 seconds. The model is equipped with a range of safety features, including an upper and lower mechanical area guard, an emergency stop button and an adjustable force sensing equipment. The system is designed to meet the highest industrial safety standards. In addition, the unit comes with a range of features to reduce operational costs, including eco-friendly energy consumption and an easy-to-maintain design. ASM AD 830 has been designed for reliable, consistent production of high-quality, high-value die-attach assemblies. It provides consistent performance, offering accuracy and high throughput at every step of the production cycle.
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