Used ASM AD 830 #9400895 for sale

ASM AD 830 Die Attacher is a state of the art machine used for attaching semiconductor or integrated circuit dies to substrates. This machine offers a precision and cost-efficient method of die attachment. This automated equipment features an ergonomic control system that can adjust the precise location and force necessary for efficient and reliable die bonding operations. With an upgraded design, this machine has the capability to deliver high speed and precise die placement. ASM AD830 provides sufficient application of force, duration and burn-in cycles to ensure the highest quality, reliable and robust process performance. Its advanced design ensures that the dies are placed precisely in the required die bonding areas and are held firmly in place. Moreover, the machine is equipped with an adjustable tray to support taller dies and facilitate the output of up to 4 times faster than the previous model without compromising precision. This equipment also offers high die attach yield and low lead-to-lead variation. Through its high level of accuracy, AD 830 is able to reduce overall scrap vacuum reclaim and separate component attach costs. With an integrated camera system and microscope, each die-to-substrate connection can be accurately monitored to ensure process reliability. AD830 is an effective bonding solution that offers an automated die-to-substrate solution with reliable, repeatable results on a wide range of substrates and lead frames. This machine is suitable for applications such as low contact force die attach, multi-die attach and die scrape. Its simple design and setup, precision and reliability make it the ideal choice for cost effective production die attaching processes.