Used ASM AD 830 #9400899 for sale

ASM AD 830 is an automated die attacher that is used to attach dies to wafers in the semiconductor packaging industry. This type of machine is used in processes that involve die cutting, die picking, and die adjusting. ASM AD830 is capable of performing these operations with high accuracy and consistent outputs for both flat and non-flat dies. AD 830 has a modular and adaptable design that can be customized to meet specific requirements of various industrial applications. It uses proprietary servo motors and advanced controllers to ensure accurate die placement and tension control. It also features an in-line vision system which can provide real-time feedback for die placement parameters. The system is also equipped with a laser sensor-based measurement and adjustment unit, which is used to adjust the die height, X and Y coordinates, and the Z-axis angle. AD830 has two-axis independently controllable motions for die attaching, with multiple adjustable parameters such as speed, force, and delay. This machine also has an adjustable nozzle diameter which can range from 0.25 mm to 3.5 mm. The nozzle is also equipped with a short taper which improves die placement accuracy. ASM AD 830 also provides automatic or manual heat control settings. The temperature settings range from room temperature to 250°C and can be maintained with an accuracy of 0.1°C. ASM AD830 is also able to recognize die substrate substrates that range from 0.2mm to 10mm in thickness. AD 830 is a cost-effective and efficient machine, making it a popular choice for many die attaching applications. The machine is also easy to maintain and offers a low-cost replacement in case of any breakdown. In addition, the operation of AD830 is automated, thus reducing operation time, which leads to increased productivity.