Used ASM AD 8312 #9258202 for sale

ASM AD 8312 is a die attacher specifically designed for the semi-automation of die bonding in the semiconductor industry. It is an automated die bonding station which uses hot-bar techniques to bond the die to a carrier substrate. The equipment is designed for speed and flexibility, allowing it to cover a wide range of size die and substrates. ASM AD8312 has a large XY work area and provides high accuracy robotic placement of the die over the substrate. The die is first placed onto a die mount on the machine, and then the XY robot picks up the die and moves it to the correct location on the substrate, where it is then bonded using a hot-bar or other bonding technique. The integrated camera vision system ensures precise placement of the die onto the substrate. AD 8312 can be easily integrated with other machines such as wafer sorters, die bonders, and other automated equipment. It provides an integrated setup for simplified die-to-board interconnectivity. The user-friendly software allows quick and easy set up and management of the entire process. AD8312 has a temperature control unit to ensure accurate and consistent temperature during the bond process. The temperature control ensures that the die is not damaged by excessive temperatures. The machine is also equipped with a thermocouple to automatically measure and display the temperature. ASM AD 8312 is designed to be robust and reliable, and its components are rated for long-term use. The tool is also equipped with an integrated diagnostics asset to help identify any malfunctions that may be encountered. ASM AD8312 is designed to provide a cost-effective solution for semi-automation of die bonding. The model is capable of a range of applications such as telecommunication, microwave, and computing.