Used ASM AD 838 #293651160 for sale

ASM AD 838 is a high-quality die attacher designed to provide accurate and reliable attachment of chip dies to the wafer or substrate during the semiconductor fabrication process. It utilizes a flip-mounting technique that enables a single-step handling of the die to the workpiece. This technology provides superior accuracy and a position repeatability rate of approximately 8-10 um giving this die attacher an outstanding performance in the marketplace. ASM AD838 die attacher utilizes an adjustable stage and top-down vision platform that allows die placement to be both accurate and repeatable without the requirement of expensive vision systems. This machine is both compact and has a relatively small footprint, allowing it to easily fit into most any semiconductor process flow. The included Vision Handshake software provides the ability to quickly define placement parameters, store them for future use, and adjust them as needed for various process conditions. In order to ensure optimum performance, AD 838 die attacher has a number of options for customizing the placement process. It can be specified with a maximum die-placement speed of 1600 pieces/hour, and its chamber design allows for maintenance and cleanliness verification up to Class 100. The die box, tray and wafer holders are manufactured from anti-static materials and designed to minimize static electricity build-up. AD838 die attacher is driven by a powerful, high-speed motion control capable of both linear and non-linear movements. This advanced technology allows the machine to detect and adjust itself to any irregularities within the substrate or die. The machine also has a "die drop-back" feature that allows the attach process to continue if a die misses its mark, allowing the next die to be placed correctly. ASM AD 838 die attacher is an excellent choice for businesses that demand reliable and accurate die mounting, but have limited space and a cost-effective semiconductor process. Its flexibility in accommodating most substrates, easy operation, and accurate placement capability make it the ideal choice for organizations that are looking to ensure reliable, accurate and repeatable die-placement.