Used ASM AD 838 #293823234 for sale

ASM AD 838 is a state-of-the-art die attach machine specifically designed to precisely attach integrated circuit die to substrates or lead frames. ASM AD838 provides a consistent and reliable die bonding process which ensures optimal performance and accuracy in the assembly of semiconductor packages. AD 838 is a four axis equipment which provides x, y, z and two rotational axes for precise alignment of the die to the substrate. X and Y axes provide moves up to 200mm in each direction in the XY plane while the Z axis provides 14mm of vertical movement in order to accurately align and attach the die to the substrate. The two rotational axes provide up to 65 degrees of tilt for unparalleled precision and accuracy in the die attach process. The platform of AD838 is equipped with two heated die attach heads which are controlled and pre-programmed with specific attach parameters to ensure optimal temperature and speed during the attachment process. The die attach heads can also be outfitted with degassing needles and multi-tip attach tools to provide more flexibility and control when attaching the die. ASM AD 838 is PLC standard based which provides a reliable, safe, and easy to use platform for production. All parameters are stored in the system's memory for use as required. Dedicated operator terminals are provided for easy and intuitive control of the unit. ASM AD838 is also designed with safety in mind. Safety features such as an E-stop and Emergency Shut Down Prevent the machine from operating in unsafe scenarios. Detached particles and larger debris are also removed from the substrate before completion of the die attach process to ensure optimal package reliability. AD 838 is an ideal tool for semiconductor packaging applications that require accurate die attach and uniformity in both the quality of the process and the final product. The combination of its versatile control parameters, accuracy, reliability and safety features make it a highly desirable choice for a successful die attach process.