Used ASM AD 838 #9305005 for sale

Manufacturer
ASM
Model
AD 838
ID: 9305005
Vintage: 2014
Die bonder Auto wafer table, 8" Rotating bond head 2014 vintage.
ASM AD 838 is a high-performance, automated die attach equipment designed for both manual and automated high volume production. It is a fully automated die bonder that can be used in the production of all types of semiconductors, including flip chip, wire bond, and substrate attach packages. The system is suitable for production of different packages ranging in numbers from tens of thousands up to millions of packages. ASM AD838 features a very rigid frame that allows for highly precise and repeatable levels of die attach accuracy. It uses a vacuum pick-up tool in combination with a high-performance vision unit for accurate part placement. This pick-up tool is designed for both high-volume production and single-die bonding application. The high-performance vision machine has the capability to identify multiple corner die locations, and is also capable of finding any die misalignments or failed copies. AD 838 also offers ergonomic, easy-to-operate controls for the operator, as well as integrated access to software for remote operation. The software also enables simple operation and training for process applications. A wide array of process parameters can be adjusted by the operator to ensure optimal production speeds. For assembly purposes, AD838 offers secure die attach with a fast work-piece feeding tool. The machine features an array of process parameters that ensure the accurate transfer of die to the substrate. The asset also ensures proper heat binder circulation and temperature control, to ensure reliable and repeatable die attach. ASM AD 838 also offers a wide range of safety features, such as in-built safety interlocks and multiple quality control check points. Moreover, the machine is CE compliant and UL recognized, which ensures peace of mind for the operator. Overall, ASM AD838 is a high-performance and reliable automated die attach model that can be used in the production of a variety of semiconductor packages. The wide range of safety features and easy-to-operate controls make this machine ideal for manual and automated production processes.
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