Used ASM AD 838 #9375101 for sale

ASM AD 838 is an automated die attacher produced by ASM Assembly Systems. This die attacher is used to fasten and secure dies to lead frames to provide electrical connections in chip packages, allowing them to be placed onto electronic boards. ASM AD838 is suitable for chip packages ranging in size from 8 to 38 mils and utilizes die fastening forces up to 900g. It is equipped with a high precision vision equipment for die placement, which is capable of aligning the die with a correct orientation and placement accuracy of less than 10 µm. AD 838 is designed with a low cycle time and improved throughput and supports multiple component configuration. It is equipped with a dedicated software package to allow operators to configure the machine with manual settings. This includes settings related to frame size, die size, pick-up angle, and nozzle force. All of the necessary settings can be configured in minutes, so that the system is ready to start die attaching immediately. The ADS 838 is a highly reliable unit and reduces die scrap rate. Its vision machine ensures accurate alignment of the die and lead frame every single cycle, and the fastening force is adjustable for different types of dies and lead frames. The machine is also designed with a self-diagnosis function to detect and alert operators of any operational abnormalities. The self-diagnosis results can be easily accessed via the user interface so that quick repair or adjustments can be made. The ADS 838 is built to increase production uptime and reduce maintenance cost. The machine has a long-term high-precision die attaching accuracy and provides high-performance die attaching capabilities with its low cycle time. The ADS 838 is also able to detect and identify multiple die shapes, and supports different flip chip configurations. Overall, the ADS 838 is a reliable and efficient die attacher solution suitable for chip package production. This die attacher provides high accuracy and good flexibility in terms of part settings, and is built to reduce a potential for die scrap rate. In addition, its self-diagnostics capabilities and low cycle time enable it to be a reliable production solution.