Used ASM AD 838 #9389935 for sale

ASM AD 838
Manufacturer
ASM
Model
AD 838
ID: 9389935
Die bonder.
ASM AD 838 is an automated die attacher developed by ASM Automation. This device is used for attaching die, such as chip carriers, to components such as lead frames and packages. It features a high quality, reliable tack welding and die attach process with repeatable accuracy and process capability. ASM AD838 holds up to 8 × 8mm components in a die-rack pick and place tooling equipment, as well as up to 6 die in discrete pockets in its precision-controlled die cam. The uncompressed traveling column dicer, in combination with the 6 die pocket cams, enable it to accurately position and position die and substrate parts in the die attach process. This is all managed by the advanced ASM XVision 3-D vision system, which is capable of 3-D vision registration using industry-standard RBG cameras. AD 838 also features an advanced monitoring unit with real-time and post-process analysis capabilities. This allows for the optimization of process parameters in order to ensure integrity and reliability in the processes being performed by the machine. Additionally, the machine has an integrated operator console and integrated data acquisition machine for improved productivity and traceability. The die attacher's process options include infrared-based bonding, press-tack welding, scorch welding, resistive bonding and pulse arc welding, all of which are suitable for chip, die or substrate parts. The process can range from 5 second tack welding to 5 hour die attach processes, depending on customer needs. The machine has an owner-validation hood, wafer cassette and die-per-bed indexing capabilities, as well as a material deposit, identification, process oven, power supply, and a variety of safety and maintenance accessories. AD838 is a reliable and versatile device for the automated die attach process that can accurately position and attach die to components with repeatable accuracy and process capabilities. Its advanced monitoring tool and integrated data acquisition asset provide a complete range of services to ensure a high quality and efficient die attach process.
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