Used ASM AD 838L #9386997 for sale
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ID: 9386997
Vintage: 2013
High speed epoxy die bonder
Wafer lift and automated handling for 8" wafers
PC Controller
ASM Vision system inspection and alignment
Multi wafer cassette input
Magazine input / output
Wafer input system:
Automatic wafer changing, standard
Enhanced MTBA automatic wafer loading system
Optional special ring pair input on adaptor plates
Bonding system:
Linear motor driven high precision sorting head
Contact less placement algorithm with feed back system
Double decoupled X / Y / Z axes of the bond head
Synchronized pick motion using linear ejector
ASM Vision system:
Different algorithms
Placement accuracy: SUB PIXEL PRS
Advanced wafer inspection
P Version up look camera
Rotary bond arm X / Y / Θ die placement
Epoxy dispensing:
Dual epoxy dispensing system
Standard syringe dispense epoxy writer
Work holder system:
Device conversion
Moving carrier for indexing substrates
2013 vintage.
ASM AD 838L is an advanced die attacher that offers the utmost in accuracy and convenience for various production needs. Created with high grade stainless steel construction and rugged mechanical components, the 838L is designed to be durable and extend its life for years of dependable use. The 838L is an automated die attacher that easily attaches wires to chips or other substrate packages with unprecedented speed and precision. The attacher features a quill that is centered about the center of the die for precise placement and an integrated vacuum equipment that holds pieces securely in place while they are being attached. This combination allows for highly accurate wire placement and repeatable operation, even at high attachment rates. The 838L is equipped with a sophisticated control system that allows for the precise adjustment of parameters such as wire position, amount of force applied, and other process settings. Additionally, the control unit keeps track of process variables such as temperature, speed or nozzle position to ensure that the process is always within design specifications. The 838L is designed with a safety interlock and emergency stop feature that ensure the operator's safety in case of an unexpected emergency. Furthermore, the 838L can be combined with an air-cooled digital dispensing machine that increases the accuracy of the die attachment process. This dedicated tool further ensures the highest quality of assembly. The 838L is also designed with a user-friendly interface that makes setup and operate for workers of all skill levels. The intuitive and customizable graphical menus make it easy to customize settings like solder length, temperature, and speed to match the die attachment needs. The 838LP also allows for integration with pick-and-place systems, as well as other Inertial Measurement Unit (IMU) systems, for an even higher level of automation and control. ASM AD838L is a revolutionary device that offers complete control and accuracy for high-volume die attachment processes. With its robust design, user-friendly interface, and capability for integration with other systems, the 838LP can provide an unparalleled quality product in significantly less time than standard die attachers.
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