Used ASM AD 860 #293671786 for sale

ASM AD 860 is an automated die attacher that is specifically designed for applications where accurate contact between an electronic component and a printed circuit board is required. This equipment uses die attach adhesive to provide a reliable adhesive bond between an IC chip and the printed circuit board. ASM AD860 consists of a die attacher head featuring a Hot Point soldering system, a camera, alignment sensors, and die attach unit that can accommodate both standard and custom packages. The Hot Point soldering machine uses the thermal conductive flux of the solder wire to increase the quality of the soldered joints. The camera accurately inspects the quality of the joints and ensures that there is no leakage. The alignment sensors ensure that the components are accurately aligned to the board while the die attach tool is capable of dispensing the required amount of adhesive for a strong bond. The asset also features an automated spin chuck which helps in precise positioning of the IC chip. This ensures that the chip is placed accurately on the board and the IC die is perfectly aligned to the board. The model is also equipped with an automated die attach head that uses a vacuum grip to pick up IC chips from the die attach tray. The sensors on the equipment monitor the pressure as the die is picked up and re-positioned to the board. AD 860 is optimized to reduce cycle time while ensuring a strong adhesion between the IC chip and the board. It features a die attach rate of 1 second per chip, a precision of 1 mil, and a repeatability of 0.8 mil. This system allows for an accurate and reliable bonding of chips in a fast and repeatable manner. AD860 is ideal for use in automotive, consumer electronics, telecommunications, and medical devices. It offers an efficient solution for high-volume production of electronic devices.