Used ASM AD 860 #9392450 for sale

ASM AD 860 is a programmable die attacher designed for automated processing of semiconductor packages. It consists of a machine base, an integrated die bonder, and a deployment scope for precise assembly. The device is equipped with a vision equipment that utilizes a high precision camera and a laser displacement sensor to perform precision alignment, assembly verification, and post-assembly inspection. The machine is designed to perform automation of small to medium size die attach production with a setup time of less than 15 minutes. The intuitive user interface of the machine allows for simple setup and operation. The machine offers up to 10 programmable stages per die attach cycle with adjustable up/down speeds and pressure settings for greater flexibility and control. It has the ability to control each pick-and-place motion and can store up 100 parameter settings and recipes for repeatability and accuracy. The machine offers high accuracy die attach placements with ±25 micron accuracy and repeatability. The die attach force can be adjusted in both vertical and rotational directions to control feedback force in post-attach processes such as Automated Optical Inspection. The placement speed of the system can reach up to 50mm/s with the capability of forming bumps from 0.6mm to 10mm, allowing efficient die attach processing of a wide variety of packages. ASM AD860 is equipped with a dispense unit capable of handling die attach adhesive, epoxies, and conductive glue with adjustable speed and pressure. The machine is designed for cleanliness with a 0.2µm filtration machine and direct exhaust to the outside, eliminating the need for costly dedicated dust hoods. In summary, AD 860 is a precise, programmable die attach tool designed for efficient and repeatable assembly of packages. The machine offers precise alignment with ±25 micron accuracy, adjustable up/down speeds and pressure settings, and dispense capability for a variety of die attach adhesives. This machine is an ideal solution for the automated die attach processing needs in the semiconductor industry.