Used ASM AD 860M #9361879 for sale

ASM AD 860M die attacher is an advanced die bonding machine used in the semiconductor industry. This high-capacity die attacher is designed to automate the die attachment process in semiconductor manufacturing. AD 860M is the latest in a line of high-performance die bonders that provide advanced features for ASIC packaging and system-on-chip production. The machine features a compact size and a small footprint, making it perfect for use in space-restricted production facilities. It features a fast pick-and-place process with quick loading times, allowing for high-volume die attachment operations. The machine uses a needle-like tool to attach the dies to the substrate in a precise and consistent manner. It is designed to provide single- and double-sided die attachment, allowing for the assembly of components and other pieces of the circuit board. The machinery also has automatic vision alignment capabilities to ensure that the dies are positioned correctly and aligned to the substrate on the substrate. ASM AD 860M die attacher is configured with a color monitor for easy operation, and it is equipped with an integrated PC, which allows for remote operation and control. It also comes with an equipped wafer mover and an integrated controller for monitoring the process. Its built-in microprocessor equipped with programming language also allows for a more efficient design of programmed procedures. AD 860M die attacher is a reliable solution for die bonding and provides precision performance. It can handle a wide variety of die sizes and types, including QFNs, QFPs, MLF, and more. The machine also features a robust design that can withstand high shock, vibration, and temperature levels. The automated die bonding machine is backed by a twelve-month warranty and a thirty-day satisfaction guarantee.