Used ASM AD 860M #9366792 for sale

ASM AD 860M is a die-bonding equipment that uses a computer controlled platform and precision motion system to place surface mount components onto PCBs (Printed Circuit Boards). This unit is designed for use in high volume production environments, offering a combination of speed, accuracy, and flexibility. AD 860M includes an 8.9-inch LCD panel, providing an intuitive graphical interface for machine operation and control. The touchscreen panel includes a graphical diagram of the pick-and-place tool for quick and easy visualization of component placement. The asset also includes a high-resolution inspection camera that enables precise alignment control for accurate and reliable die-bonding results. ASM AD 860M offers an integrated placement of devices such as die-bonding, metal balls, and multi-row connectors, as well as adhesive and SMT components. It can handle a variety of standard or special packages such as BGA, QFP, CSP, QFN and MCC. The pick-and-place model can place components with a pitch of 0.4 to 25mm, a height of 0.7mm to 5mm, and a weight of 5 to 160 grams. AD 860M is capable of accommodating a variety of customizable feeder systems, making it easy to configure an optimal setup for materials and components. The equipment also includes an integrated calibration mechanism for automated alignment adjustments, and features automatic nozzle cleaning to prevent any contamination of the component. The reliability and quick operation of ASM AD 860M allows for high-speed and high-accuracy placement of components onto PCBs. This system has been designed to optimize the efficiency and quality of production processes in the manufacturing industry, and is a reliable choice for high-volume production lines.