Used ASM AD 862 #9378770 for sale

ASM AD 862 is an advanced die attacher for modern multi-die attaching applications. It offers an efficient and reliable method for attaching dies to substrates, such as integrated circuit dice, equipment-in-package (SIP) dies, and flip chips. Using high precision linear actuators and high speed robot arms, it precisely positions components over the desired substrate and then applies pressure to attach them in a uniform, controlled manner. For optimal die placement accuracy, the system features a vision-guided unit that inspects the substrate and its contact pads for proper alignment and location. With the help of high speed robot arms, the machine quickly moves components into position, gripped with a vacuum nozzle, and precisely positions them on the substrate, while the vision tool monitors the process to ensure accuracy. Numerous vision patterns and settings are available for automated assembly and inspection processes. The advantage of using AD 862 is that it enables die attaching to be achieved in a very short period of time without sacrificing accuracy. Its precise positioning allows for extremely small clearances between die and substrate, and it is able to handle die sizes ranging from micro-dice to much larger flip chips with ease. This makes it ideal for high-density applications. The high speed robot arms can also be combined with an in-line addition of soldering paste, and the die-attach can be soldered immediately after it is affixed. The vision asset also has soldering-defect detection capability and can signal the robot arms to pause and end the process if any defects are detected. In addition, the model features flexible connectivity and software interfaces. It can be integrated with a variety of control systems, and it can be used with a variety of programming languages. Overall, ASM AD 862 die attacher is a highly efficient, cost-effective solution for high density, sub-micron die attaching applications with excellent accuracy and repeatability. It is capable of handling a variety of components and substrates, and can be combined with in-line soldering paste applications for immediate soldering of die-attach.