Used ASM AD 862 #9383139 for sale

ASM AD 862 is a die attacher designed by Advanced Semiconductor Materials (ASM) for semiconductor manufacturing. It is a fully automated die-bonding machine designed to process integrated circuits (ICs) with very short cycle times. AD 862 can be set up to operate in either wet or dry mode, allowing for the efficient attachment of die to substrates. Additionally, ASM AD 862 is capable of die-sorting, as well as the positioning and bonding of die to substrates with an accuracy of ±0.05 mm. AD 862 is equipped with a die handling equipment, a multi-axis robot arm with an ultrasonic bonder, a vision system, and a CCD camera. The die handling unit is used to accurately syringe die onto an alignment carrier in either single picks or dual picks. The CCD camera is then used to check the die positioning before the die is attached to the substrate. The robot arm is responsible for positioning and attaching the die to the substrate, while the ultrasonic bonder is used to weld the die to the substrate, using either thermocompression or thermosonic bonding processes. ASM AD 862 is designed to work with substrates up to 160mm in size, and features a flexible conveyor machine able to process carrier tape or waffle trays, as well as individual substrates. AD 862 also has a user-friendly interface, a robust construction, and a forced-air cooling tool to ensure reliable performance in a wide range of temperatures. Moreover, it is also equipped with safety features, automatic maintenance and calibration programs, and diagnostics that allow for real-time monitoring of parameters to maximize tool utilization. Given its features and automated processes, ASM AD 862 supports fast, accurate, and reliable IC assembly. It is considered one of the most versatile and reliable IC die attach machines on the market, and is widely used in the semiconductor industry for the attachment of die to substrates.