Used ASM AD 862M #9399686 for sale

ASM AD 862M is an industrial-grade die attaching machine used for mounting and affixing dies to printed circuit boards. It is a high-precision, versatile die attaching equipment with a maximum die attach force of up to 26 kgf. The device is suitable for attaching micro parts in a variety of sizes used for applications such as RFID, microelectronics and semiconductor packaging. The device has a wide range of high-speed placement speeds, allowing it to accurately position dies onto a circuit board within mere milliseconds. It equipped with a precision die pickup area and non-contact pickup feature that eliminates the risk of any damage to the die. AD 862M has a compact design and is suitable for a small work space. It features a small form factor and a range of features like variable speed pump, xenon illumination, cleaning kits, and die attach head system. It also has an advanced vision unit that is integrated with advanced image recognition technology to accurately identify, align and attach dies onto a PCB with high speed and precision. The device has an arranged maximum die attach area of 36 x 48mm, allowing for a wide range of die sizes to be attached without needing to be repositioned or adjusted. ASM AD 862M also includes a touch-screen control unit for adjusting settings like the maximum placement force, positioning accuracy and comment times, as well as the die attach area for customized applications. Additionally, the machine includes a range of die attach settings and automatic compensation settings to eliminate potential errors from the placement process. In terms of safety and reliability, the device has an array of innovative features like a local emergency stop and alarm machine that allows it to be safely shut down and contained in case of emergency situations. The machine is equipped with a shock absorber and burrcatcher tool to minimize any risk of accidental damage to the circuit board or the attached die. Overall, AD 862M is an easy to use industrial-grade die attaching machine that is capable of high-speed, accurate die positioning and attachment. The device is ideal for a range of microelectronic and semiconductor packaging and RFID applications, offering exceptional precision and speed while reducing the risk of any damage to the die or circuit board.