Used ASM AD 889 #9299468 for sale

ASM AD 889 is a die attacher designed for the automatic ternary bonding of small dies with controlled compression force. It is suitable for microelectronic components, specifically for the interconnection of a die, or power device, and/or a retainer to a lead frame. ASM AD889 is capable of bonding both non-DIP and DIP configurations. The equipment consists of a chip bond head, vibration modules, as well as a high accuracy die positioning system. The chip bond head of AD 889 is a motorized bonding head and is designed for dispensing a small amount of bonding material to form interconnects and securely attach a die or other component to a substrate. The bond head is equipped with a vibration module and is controllable with the supplied PC controller. This vibrational module allows for precise material absorption and dispersion, ensuring the die is accurately attached to the lead frame without damaging any components. AD889's die positioning unit is of the highest accuracy and it is capable of accurately locating the die on the lead frame. The accuracy of the die position is further enhanced by the precise vibrational module featured by the bond head. This allows for the die to be perfectly centered and for a consistent bond line. Furthermore, the machine ensures that components are securely attached with a controlled compression force to avoid any potential damage. In summary, ASM AD 889 is a top-of-the-line die attacher that is perfect for microelectronic components. Its chip bond head is equipped with a vibration module to ensure the die is correctly positioned and securely attached, while its die positioning tool ensures the highest accuracy. The asset's controlled compression force then ensures that components are not damaged during the attching process. All of these features combined make ASM AD889 the ideal choice for securely bonding dies to lead frames.