Used ASM AD 889 #9389744 for sale

ASM AD 889
Manufacturer
ASM
Model
AD 889
ID: 9389744
Die bonder Output loader magazine Monitor Leadframe loader Sensor amp Power supply Pneumatic relay box No board console.
ASM AD 889 is a die attacher machine designed and engineered for easy and precise attaching of semiconductor dies. It is specifically suited to most semiconductor processtechnology nodes supporting silicon wafer diameters from 8 inch (200 mm). It can precisely dispense low viscosity die attach material to a high level of repeatability and accuracy. The machine features a laser-based global X-Y-Z coordinate adjustment equipment, a dual pick-up head for multi-die dispensing, independently adjustable counter-weighs to alter focal distance, and a software-stored file management system for easy user interface between die sizes and processes. ASM AD889 uses a camera-driven vision unit to guarantee exceptionald accuracy during the die attach process. A programmed die attach pattern is attained by moving the dispensing head in both X-Y-Z axes of a three-dimensional plane. This ensures a consistent alignment of each individual die on the IC device, allowing for precise die-to-die registration and accurate part placement. AD 889 also uses an accurately controlled material dispenser to apply a precise amount of die attach material to the wafer. This process reduces waste and helps to ensure repeatability and consistent material dispensing. The controllable focal distance also allows for easy adjustment to accommodate various die height differences. Additionally, the machine includes a laser inspection machine that provides real-time feedback on die placement, dispensing patterns, and accurate position of the die on the wafer surface. It also comes with comprehensive file management software, allowing for single and multi-operator support. AD889 is a precise, reliable, and robust die attach tool, designed for semiconductor dies smaller than 8 inch (200 mm). Its acute accuracy, adjustable focal distance, real-time visual feedback, and software-based operations help to ensure consistent repeatability and air-seal each die onto the IC device. Thanks to its automated processes, ASM AD 889 has become an invaluable tool for semiconductor manufacturers.
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