Used ASM AD 889 #9390098 for sale

ASM AD 889 is a die attacher developed by Advanced Semiconductor Materials (ASM), a global leading supplier of advanced materials for the microelectronics industry. The machine is designed for attaching dies to substrates for the purpose of wire bonding. It has a dual head equipment, meaning that it can simultaneously process two dies at the same time. The die attacher is equipped with a vacuum table and a die positioning platform, which are used to accurately position and hold substrates in place during the die-attach process. The machine uses a fully automated die seat preparation system to ensure precise die placement. It is equipped with a precision microchip-processing platform, allowing die to be precisely aligned and attached to the substrate. The unit has a programmable control unit, which can support a wide range of die patterns and applications. It also has an automated retractable head feature, which eliminates the need for manual handling of delicate substrates. ASM AD889 is capable of producing high-yield attach processes, as it uses advanced material with high thermal conductivity for increased heat dissipation during the attach process. The machine environment is maintained by an air-conditioned enclosure, which prevents thermal damage to the material. The machine also utilizes an in-situ wafer cleaning machine, which ensures clean surfaces for reliable die attach. The die attacher can also be used for die-bonding applications, where there is an additional need to attach various parts to the die. It has a built-in microscope, which is used to inspect the quality of the attachment between the die and substrate, allowing it to be used for low-volume die-attaching and high-volume manufacturing as well. Overall, AD 889 die attacher is a reliable and precise machine, which is able to handle a variety of die-attach and die-bonding processes. Its built-in features such as the programmable control unit, automated retractable head, and in-situ wafer cleaning tool increase its accuracy and efficiency for high-yield processes. It is ideal for both low-volume and high-volume manufacturing applications.