Used ASM AD 8912 SD #9285961 for sale

ASM AD 8912 SD
Manufacturer
ASM
Model
AD 8912 SD
ID: 9285961
Vintage: 2009
Die bonder 2009 vintage.
ASM AD 8912 SD is a high precision die attacher from ASM International designed for precisely attaching dies to a variety of substrates including silicon wafers, glass, metals, and plastics. The device is especially useful for attaching arrays of dies to substrates with high accuracy, and is particularly well-suited to MEMS applications. AD 8912 SD features a motion platform with a micro-sized die attach head and three-dimensional motion control, enabling highly accurate attachment of die arrays with an accuracy of 2.5um per axis. The equipment also features a thermal management system which ensures consistent die-temperature during attachment, eliminating assembly defects caused by thermal fluctuations. In addition, user-defined conditioning time enables the device to heat from room-temperature to the desired set temperature, thus minimizing temperature-induced stress in wafers. ASM AD 8912 SD can be easily integrated into various manufacturing processes with manual and automated options. It is equipped with dual stage vacuum control, allowing vacuum on demand during the die back grinding process for vacuum-supported grinding. The device also features a load/unload interface which supports an automated process of loading and unloading of substrates. The device can be equipped with various die heating systems such as die hotplate, IR furnace, and plasma heater. This facilitates the use of die sizes and number of dies, as well as various materials like silicon, glass, aluminum, and plastic, and various application requirements. Moreover, the unit is capable of batch programming, allowing multiple types of automated sequences to be performed and ensuring uninterrupted assembly operations. AD 8912 SD offers an increased flexibility and versatility for die array assembly. Thanks to its user-friendly and intuitive interface, high accuracy, thermal management machine, automated loading/unloading of substrates, die heating systems, and batch programming capabilities, it is an ideal choice for high precision die assembly in automated manufacturing processes.
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