Used ASM AD 8912 SDCP #293662006 for sale

ASM AD 8912 SDCP is a fully automatic die attach machine designed for thermal die bonding. It utilizes a variety of heating elements such as resistance heated silicone mats, hot tweezers, and hot bar soldering to bond a variety of electrical components to a substrate. The unit features a multi-zone temperature control equipment, with timer-controlled preheating and cool down, temperature ramping and constant temperature settings for superior die placement and temperature control. The die attach machine can bond both traditional leaded dice, as well as lead-free dice. It also has the capability to place leaded dice in 'stack and matrix' configurations (i.e.: one die over another) and with the use of a silicone stamp, can also be used to place die-on-die bonding in a "double stack" configuration. The unit also includes an automatic feeder along with an on-board vision system that allows for inspection of parts prior to bonding. The standard work area is 200mm x 200 mm with a maximum height to accommodate thicker lead frames. There is an optional wide chuck for larger dies and some of the larger packaged parts. The machine can operate up to two thermal heads. When two heads are used, the two-piece, articulating manipulator offers greater die placement accuracy and flexibility for parts placement. The articulating arm can be programmed for either a moving pick station conveyance type of operation or a two-stage pick and place operation. AD 8912 SDCP includes a built in pressure regulator and optional pressure sensors that provide feedback on force during the die attach process. The force readings/settings are programmable with the software to ensure optimum bond force is used. This unit is capable of dispensing glue, epoxies, and solder alloys, and comes with an air-cooled vacuum machine with a multiple-point needle pickup for over-sized parts. It also offers selectable, optimized thermal profiles for different die types. Overall, ASM AD 8912 SDCP die attach machine is a highly accurate and efficient solution for thermal die bonding, offering both traditional leaded die bonding and lead-free die bonding. With its multi-zone temperature control, programmable force settings, vision tool, and multiple head configurations, this machine is the ideal choice for medium and high-volume PCB assembly operations.