Used ASM AD 8912 SDCP #9286054 for sale

ASM AD 8912 SDCP is a die attacher designed for manual bonding of semiconductor chips to substrates with spin-direction-controlled (SDCP) die bonding technology. This equipment offers precision die attach accuracy and repeatability, enabling users to achieve higher yields in flip-chip assembly. AD 8912 SDCP is an automatic die attach system that utilizes spin-direction-controlled (SDCP) die bonding technology. This technology utilizes a small, fast spinning tool that allows for precise control of the placement and orientation of the die. The unit is capable of producing repeatable performance with minimal variation in the pitch and yaw axis of the die, enabling consistent chip-to-substrate contact. ASM AD 8912 SDCP can control die height and rotation angle of the die using an optical microscope to guide the tool. AD 8912 SDCP is equipped with a high-speed displacement detector which enables the machine to accurately detect small steps in the chip location and automatically adjust the speed and/or the spin direction. This ensures accurate and reliable die placement and positioning. The tool also features a four-phase die attach control asset to minimize vibration and noise levels during operation. ASM AD 8912 SDCP is robust yet easy to use with a graphical user interface that provides intuitive setup and process monitoring. The model is also compatible with a variety of chip sizes, enabling bonding of single die chips as well as multi-die packages. Additionally, the equipment is designed with a low flow rate and low heat dissipation to minimize environmental impact and ensure long-term reliability. AD 8912 SDCP is an ideal choice for chip attach applications in many industries, including automotive, medical, consumer, and industrial. The system is also suitable for high-speed production and offers an impressive die attach accuracy of 1µm or less, while providing reliable yields in both flip-chip and wire bond technologies. Furthermore, the SDCP technology enables automated yield optimization through fast, precise die placement and allows for better control of the chip rotation angle as well as die height.