Used ASM AD 8912 #9080851 for sale

ASM AD 8912
Manufacturer
ASM
Model
AD 8912
ID: 9080851
Die bonder.
ASM AD 8912 is a high-performance die attacher suitable for industrial applications. It is designed to place and attach low-profile dies on a wide range of substrates such as lead frames or wafers. In order to provide consistent and accurate results, ASM AD8912 features a novel die placement head with integrated vision equipment. The integrated vision system is capable of recognizing die shapes, positions, and heights. It can also measure die skew and twist. This allows the unit to quickly and accurately locate the die on the substrate, and perform the necessary placement and bonding steps with precision. AD 8912 also comes equipped with a powerful vacuum suction machine for die placement. This vacuum is used to pick up the die off the tape or film, and secure it to the substrate while the placement head positions it. After the die is secured, a vacuum assisted die alignment press is used to apply force to the die. This press removes any potential misalignment caused by the die pick-up and placement process. AD8912 also has a built-in tape placement tool which can accurately position industry standard die attach tapes. This feature is an essential for any modern die attacher, and helps ensure accuracy and reliability. Moreover, ASM AD 8912 is capable of handling both lead frame and wafer dies. It can easily switch between the two and adjusted accordingly based on the die size and substrate material type. This means that the asset can handle low-lead-count WLB as well as flip-chip dies. ASM AD8912 is designed with a modular architecture, making it possible to easily upgrade and maintain the model. As such, it is suitable for use in a wide range of different production environments. Overall, AD 8912 is a reliable and cost-effective solution for die attaching needs. It features a powerful integrated vision equipment, a powerful vacuum suction system, and an industry-standard tape placement unit. Moreover, it is capable of handling both lead frames and wafers, making it an ideal solution for any assembly line.
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