Used ASM AD 8912 #9244284 for sale

Manufacturer
ASM
Model
AD 8912
ID: 9244284
Wafer Size: 8"-12"
Vintage: 2007
Die bonder, 8"-12" 2007 vintage.
ASM AD 8912 is a die attacher, specifically designed for automated and intuitive die attach operations in various industries. It is manufactured by ASM, a leading supplier of machines, tools, and services for the fabrication of semiconductor devices. ASM AD8912 includes innovative technologies and intuitive functions to streamline die attachment operations. It has a controlled and closed loop kinetic equipment, allowing both two-point and ball attach operations in a single cycle. This helps to maximize throughput, maximizing adhesive uniformity and ensuring reliable connection. The tool also offers a reliable and adjustable precision die pick-up system that allows for repeatable accuracy in locating dies, including variation in height and tilt. AD 8912 is equipped with a fully automated capability to handle larger die sizes. It has a built-in, advanced motion controller for fast, precise and accurate control of motion, including die pick-up and placement. The tool also has CC-Link and Modbus interfaces, respectively providing communications and control between peripheral devices and AD8912. Furthermore, the tool has an integrated automatic arm cleaning and adhesive supply unit, allowing for continuous operation and maximum speed and resolution. Compared to manual die attach methods, ASM AD 8912 offers superior reliability and speed for die placement. The use of an advanced motion controller and the integrated adhesive supply machine allow the tool to work quickly and accurately, ensuring that the dies are place with consistency and accuracy. Additionally, the CC-link and Modbus interfaces enable the tool to connect with and operate with peripherals. In conclusion, ASM AD8912 is an intuitive, reliable, and automated die attacher that allows manufacturers to automate and speed up their die attach operations. AD 8912 ensures consistent, reliable and accurate placement of dies, making it an ideal tool for manufacturers involved in semiconductor device fabrication.
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