Used ASM AD 8930 #293634988 for sale

ASM AD 8930 is an automated die attacher specifically designed for attaching wire bonded semiconductor and LED die onto substrates. It is particularly useful for high-volume production runs in wafer processing and LED manufacturing. ASM AD8930 boasts high repeatability, accuracy and reliability throughout the die-bonding process. The equipment utilizes a non-contact overhead vision system and advanced algorithms to allow for precise die placement and bond formation. A precision die site pre-aligner optimizes the device placement, while a high vacuum hold-down clamp ensures the device is held firmly in place throughout the process. AD 8930 utilizes a heated die-bonding wedge and precision motorized X-Y stages in conjunction with the non-contact vision unit to accurately align and bond the die to the substrate. The heated die-bonding wedge is adjustable to accommodate various thermal requirements for optimal performance. The X-Y stages are capable of precise incremental movements, allowing for precise die positioning and precise die bonding. AD8930 also features a flexible wirebond module that can accommodate various process window requirements. The machine's advanced programming capabilities allow for customized configuration and parameter setting for each application. The module includes a number of built-in safety features including a lockout cover, height-limiting stop and thermal shut-off. ASM AD 8930 provides a range of benefits, including high-quality connections, improved performance, fast turnaround times and low cost of ownership. Through its automated design and leading-edge technology, ASM AD8930 enables efficient and accurate die-bonding processes while minimizing the risk of human error. This makes the tool ideal for high-volume production lines and enables manufacturers to increase productivity and reduce costs.