Used ASM AD 8930 #293654179 for sale

ASM AD 8930 is an automatic die bonder (or die attacher) which is used for packaging integrated circuits. It features a rotary die indexer which rotates around a sprocketed wheel to place dies in the optimal bonding position for production. The bonding process is performed using a thermosonic gold ball bonder. ASM AD8930 has an automated handling system which is designed to increase the accuracy of each bonding process and the overall yield. The die-attacher has an integrated vision system which makes it able to accurately measure and verify positional accuracy of each die. It also has a speed-controlled bonder arm and a built-in micro-adjustment device to fine-tune bond parameters like pressure and time. In addition, AD 8930 has a repeatable dispensing system with an adjustable needle height and a positioning device to ensure the controlled dispensing of bonding material. It also provides an optional tray table for bulk feeding and collection of dies, as well as a wafer stacking device to stack and unstack die, in addition to a cone pick-and-place head for non-standard die movements. AD8930 also features interchangeable end effectors for routine maintenance, as well as a high-speed motion controller to provide a consistent bond-by-bond performance. It also has a heated die attach plate and a Z-Axis stage for die placement accuracy. ASM AD 8930 die attacher has a wide variety of process parameters and capabilities including accuracy, repeatability, and speed, making it suitable for almost any die attach application. It is capable of die sizes from 0.4mm to 10mm, offers a max die attach force of 10N, and a total traverse speed of 1.5m/s. The device is typically used in the semiconductor industry for high-precision and high-volume die attach needs.