Used ASM AD 8930 #9100597 for sale

ASM AD 8930 die attacher is a fully automated die bonding machine designed to provide efficient, reliable and precise die bonding to semiconductor substrates. It consists of a die head, a die bonder, a die aligner and a substrate station. The die head is designed for precise attachment of the die to the substrate and is capable of adjusting pressure to ensure the optimal bond strength. The die bonder features a closed loop equipment which ensures accurate motion of the die to accurately bond the die to the substrate. The die aligner ensures accurate alignment of the die on the substrate. It has a high-resolution imaging system for precise positional recognition of the die and accuracy up to 10um. The substrate station is capable of supporting a wide range of substrate sizes and is equipped with an air-tight seal to minimize movement of the substrate. In order to provide an accurate and reliable bond, the machine is equipped with an active thermal profiling unit. This machine features a temperature monitor to measure the temperature of all bonding surfaces and an active feedback control to ensure accurate and repeatable die bonds. ASM AD8930 die attacher is ideal for use in high-throughput production lines and offers high yields and protection against die damage. It is compatible with a variety of different types of semiconductor substrates such as Si, GaAs and others. It is an easy-to-use machine that requires minimal operator training and provides a consistently reliable and precise bond.