Used ASM AD 8930 #9100599 for sale

ASM 8930 Die Attacher is a state-of-the-art single-head die attach equipment designed for attaching die to a variety of substrates such as glass, ceramic, plastic, as well as printed circuit boards. The system can handle die sizes from 5 mm square to 35 mm square and is constructed with a heavy frame to provide high rigidity and accuracy. The unit utilizes a vacuum manipulated head with a servo-controlled feeder to accurately and quickly attach die to the substrate. The feeder is designed for automatic die loading and features improved accuracy over conventional feeders. ASM 8930 Die Attacher includes an integrated vision unit that enables placement accuracy and repeatability. It features an intuitive human-interactive touchscreen and an adjustable working table height. The unit includes a flexible and efficient head movement control, which is suitable for a range of different application needs. The adjustable temperature control in the machine helps ensure optimal die attach performance. The tool utilizes compressive soldering with a heated soldering nozzle to attach the die to the substrate. The die attach procedure involves determining the die boundaries by using the vision asset, selecting the best soldering spot on the substrate for each die, controlling the temperature of the soldering nozzle, and compressing the nozzle over the surface of the substrate to attach the die. ASM 8930 Die Attacher includes a core and track model which ensures that once the die is attached to a substrate, the die is securely held during the soldering process. The equipment also includes an emergency stop function which allows operators to shut down the system in the event of an emergency. ASM 8930 is a reliable die attacher that provides fast and accurate die attachment results. The unit is capable of automatically adjusting parameters to meet the requirements of a range of different substrates and applications. With its advanced vision machine and adjustable soldering temperature, the tool provides optimal die attachment performance with minimal effort.