Used ASM AD 8930 #9100600 for sale

ASM AD 8930
Manufacturer
ASM
Model
AD 8930
ID: 9100600
Wafer Size: 6"
Vintage: 2008
Die bonder, 6", 2008 vintage.
ASM AD 8930 is an automated die attach equipment specialized for the task of connecting semiconductor devices to substrates or interconnection boards. It is a self-contained robotic assembly machine designed to increase speed and accuracy of die-attach operations. ASM AD8930 is a three-axis linear handling system, with X, Y and Z axes of motion. The unit can be used for applications such as connecting electrical and electronic components to flex circuits, or for joining surface mount devices (SMDs) or components to substrate boards. The machine is equipped with a die bond head which is capable of automatic placement and precise die bonding using both pick-and-place and die attach processes. The die bond head is capable of accommodating a wide range of application specific dielectric adhesives, thermal grease and greases, as well as superglue. The tool is a highly efficient process and can be easily integrated into an automated assembly line. It eliminates errors caused by manual positioning and improves production performance by eliminating alignment issues. The asset is equipped with an integrated vision model, which allows it to accurately recognize the components to be attached. It also has advanced automation capabilities, including component counting, pattern recognition, and high-speed placement. The equipment is capable of achieving optimal reliability and precision, as well as being able to reduce defective products due to errors. The system is also easy to maintain and is built for long life, making it an ideal choice for high precision, low cost production environments. Additionally, the unit also offers cost-efficiency, as one machine can simultaneously handle multiple tasks. AD 8930 is an ideal solution for die-attach production applications, and it offers improved accuracy and reliability, as well as greater cost efficiency than manual die-attach processes. It reduces risk of defective products due to human errors and is designed with robust automation features for increased efficiency. With its small footprint and high capacity, the machine is an ideal choice for any electronics production environment.
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