Used ASM AD 8930 #9100602 for sale

ASM AD 8930
Manufacturer
ASM
Model
AD 8930
ID: 9100602
Wafer Size: 6"
Vintage: 2005
Die bonder, 6", 2005 vintage.
ASM AD 8930 is an automated die attacher that is designed to secure dies to printed circuit boards. It is capable of working with a large range of die sizes, up to 69x69mm, and can also work with taller dies with its adjustable z-axis movement. This versatile machine is capable of supporting a variety of applications, including surface mount, through-hole, and THT die attach. The die is first placed onto the substrate, where the die will then be aligned and secured in place. The equipment then uses an advanced vision system to ensure accurate placement of the die. This is done by carefully measuring each die's position and orientation relative to the substrate. This ensures the die is placed squarely and accurately in the substrate before it is secured. ASM AD8930 then uses an automated die attacher to ensure secure attachment of each die to its substrate. This is done through one of several different attachment methods, depending on the customer's needs and requirements. Various attachment methods are available, such as epoxy dispense or solder transfer. The mechanism of AD 8930 employs precision motion control capabilities that ensure smooth and accurate alignment and positioning of the die relative to its substrate. This ensures a secure and reliable connection. Additionally, the machine is capable of accurately controlling the die-to-substrate bond strength, ensuring maximum reliability. The unit also makes use of advanced fault detection capabilities, allowing it to detect any issues with the die-to-substrate connections. This includes the presence of excessive flux, incorrect alignment, or any other irregularities. In the event of fault detection, the machine will stop operation and alert its user. Overall, AD8930 is a reliable and powerful die attacher. With its advanced vision machine and precision motion control capabilities, it is capable of accurately attaching a wide range of dies to their substrates. Additionally, its fault detection capabilities ensure that each connection is secure and reliable.
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