Used ASM AD 8930 #9101928 for sale

ASM 8930 Automated Die Attacher is a machine designed and manufactured to attach dies onto leadframes for semiconductor assemblies. ASM 8930 Die Attacher provides an efficient, reliable and accurate method of die placement, and is designed to maximize throughput and minimize costs. It is fully automated and utilizes both Spot Prep and Point Solder technologies to provide optimal performance and results. The machine features an integrated die attach equipment, which consists of two different steps; die attach and point soldering. The first step, Die Attach, is where the die is placed onto the leadframe in the correct orientation for optimal performance. A specialized clamping system with controlled air pressure is used to ensure that the die is properly held in place. After the die placement is completed, the die is then subjected to a programmed point soldering process using the Point Soldering technology. In the Point Solder process, the die is subjected to applied heat to create a secure bond with the leadframe. A solder sphere that is deposited on the die prior to solder bonding is used to create the necessary connection. This process is designed to eliminate potential sources of damage and reduce the chance of shorting the connections after reflow. Once the point soldering process is completed, ASM 8930 Automated Die Attacher will complete the final operations, such as cleaning, sealing, and molding. This ensures that the die is held securely and will remain in place for the entire life of the semiconductor assembly. The built-in image recognition unit ensures that the die attach process is carried out accurately and precisely. ASM 8930 Automated Die Attacher is controlled by an easy to use graphical user interface that allows users to select various operational settings for maximum efficiency. The machine also features advanced diagnostics, including real-time monitoring of machine status, temperature and pressure readings, and support for error correction. Overall, ASM 8930 Automated Die Attacher is an efficient, reliable and accurate solution for attaching dies onto leadframes for semiconductor assemblies. Its integrated die attachment machine, built in image recognition tool, easy to use graphical user interface and advanced diagnostics ensure that the die attach process is carried out accurately and precisely.