Used ASM AD 8930 #9138224 for sale

ASM AD 8930 is a highly advanced die attach machine designed for the assembly of complex circuits. This single-handed equipment is equipped with an offline robot arm for die placement, as well as an offline vision system to ensure high die placement accuracy rates. The machine employs a process which is one of the most common in the semiconductor industry: die bonding. The unit has the ability to bond a vast variety of die sizes and technologies, including, ball grid array (BGA), chip-on-board (COB), and chip scale packaging (CSP). In addition, the machine also has the option of applying a wide range of die attach materials, including epoxies, silicone gel, solders, duro-tones and conductive adhesives. ASM AD8930 is designed with an intuitive user interface, featuring ergonomic controls, a graphical touchscreen, as well as a range of preprogrammed recipes that optimise each operation for specific die sizes and process parameters. Moreover, the tool is equipped with an offline feeder and a mini visual inspection asset, which ensure that the die are accurately positioned before they are picked and bonded. AD 8930 features a proprietary process monitoring model which enables the user to identify any process parameters that are out of the required range. It also includes a data logging feature which logs data between die attachments for further review and analysis. Furthermore, the machine offers a host of advanced features such as advanced wafer handling, component location assistance, pick-to-place optimization, as well as automated die attach compensation. AD8930 is a highly reliable machine that produces consistently good results while remaining fast and efficient. Its long-term dependability, with regular maintenance, makes it a cost-effective choice for semiconductor fabrication lines.