Used ASM AD 8930 #9168204 for sale

ASM AD 8930 is a state-of-the-art die attacher designed for precise bonding of semiconductor and optoelectronic components to substrates. The equipment is capable of handling die sizes as small as 10 mils (0.3 mm) and as large as 200 mils (5 mm) for both ceramic and ceramicless die. It offers a fast, reliable and repeatable process with process monitoring capabilities for ensuring optimal manufacturing performance. ASM AD8930 features a high-precision die bonding head that accurately applies a controlled and repeatable pressure onto the bond site. The fine motion of the die head is smoothly controlled by the servo-motor, to accurately place the die onto the substrate. A high performance vision system coupled with laser navigation further simplifies the die placement process with a high degree of accuracy. AD 8930 is optimally designed to provide a robust, cost-effective die-bonding process and features a number of advanced control options including integrated non-contact vision unit and automated data recordation. The attacher also features an intuitive Graphical User Interface (GUI) that provides step-by-step visual instructions to guide the user through the entire die-binding process. Moreover, the advanced die-bonding capability of the machine allows manufacturers to bind varieties of chip sizes, shapes and materials. AD8930 is capable of providing a clean and hermetic junction with repetitive accuracy for the highest yields. The tool is further tested for repeatability and reliability with tests covering temperature range, pressure, current and voltage. Finally, the asset is compliant with RoHS standards for meeting the safety requirements of hazardous materials in electrical and electronic devices.