Used ASM AD 8930 #9315208 for sale

ASM AD 8930 is a die attacher engineered to pick and place ultrathin semiconductor chips onto a substrate in an automated fashion. This tool was designed to improve the efficiency of chip integration in electronics applications. ASM AD8930 is equipped with integrated pick and place modules, 3D vibrating needles, and integrated vision systems. This equipment quickly and accurately positions the die on the substrate's designated surface. The pick and place system handles individual parts, enabling greater application flexibility and reducing cycle times. The 3D vibrating needles detect chips ranging in size from 1-millimeter square to 1-millimeter-by-2-millimeter chips. They have a high placement accuracy rate of 0.2 millimeters, and can move chips with a maximum placement speed of 300 chips per minute. The needles also offer a variety of options for handling multiple chips simultaneously. AD 8930's integrated vision unit performs automated tasks, such as process control and in-line quality control. This vision machine detects excessive dust contamination, surface deformations, and faulty components, enabling the machines to operate in a highly reliable and accurate manner. The 95-millimeter-by-95-millimeter table size of AD8930 offers plenty of space for accurate movements, and the rapid positioning rate of up to 500 positions per second ensures fast and accurate results. The integrated 32-bit controller with 6-axis motion control capabilities also offers efficient and precise operation, as well as vast statistical capabilities. Given its durable construction and reliable performance, ASM AD 8930 is an ideal choice for the rapid and reliable placement of semiconductor chips. This tool simplifies the assembly process of highly complicated, intricate electronics systems, and its sleek and compact design saves valuable space in industrial settings.