Used ASM AD 8930 #9364742 for sale

Manufacturer
ASM
Model
AD 8930
ID: 9364742
Vintage: 2010
Die bonders 2010 vintage.
ASM AD 8930 is a fully automated die attacher, designed to attach a wide variety of semiconductor die products to different substrates. It is a high-speed, precision machine that works with a high degree of accuracy and reliability. The individual die is fed into the machine via a die feeder, or can be manually placed in the mounting area. The die is then positioned on the substrate by the built-in visualization equipment. Once in position, the machine's patented pressure roller system presses the die onto the substrate with a precise, uniform force and creates the required bond. ASM AD8930 is capable of bonding aluminum (Al) pads with a minimum pad pitch of 0.2mm and a maximum of 1.0mm. It features an adjustable pressure roller for the optimal application of pressure for different die types and substrates, allowing for flexibility and compatibility with a wide range of products. In addition, the machine features advanced tooling to ensure precise yielding of the die onto the substrate. It also offers various waste evacuation schemes to prevent over-application of additional blocks, as well as a wafer sorting mechanism, for sorting and identifying the optimum wafer for the bonding process. The machine also features a resin dispensing unit, to ensure optimal contact between the die and the substrate, as well as an advanced die-gauging machine to ensure the desired height and accuracy of the die after bonding. AD 8930 is compliant with ISO 9001 and ISO 14001 standards, and has a built-in temperature, humidity, and contamination control tool for monitored performance in cleanroom environments. The machine's safety features also protect operators and their installations from various danger such as accidental contact with bonded components. Overall, AD8930 is a reliable and cost-effective die-bonding solution for all your semiconductor die products. The machine's advanced features, superior precision, and superior performance make it an ideal choice for any die-bonding application. Its flexibility in terms of adaptability and compatibility make it a great value for a variety of applications.
There are no reviews yet