Used ASM AD 8930UV #9383226 for sale
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ID: 9383226
Automatic die bonder, parts system
Power supply: 240 V, 50/60 Hz, 12 A, 3-Phase.
ASM AD 8930UV is a high performance automatic die attacher for microprocessors. It provides efficient, reliable and accurate attachment of dies to microprocessors. This die attacher uses advanced optical imaging technology to identify and attach the correct die to the correct microprocessor without human intervention. AD 8930UV uses a laser beam and an image capture system to quickly and accurately detect the size and shape of the die and accurately align it with the microprocessor. The laser is precisely tuned to the individual components of the die, ensuring an optimal bond between the two while maintaining precise and consistent die positioning. The laser also measures the amount of adhesive used to attach each die to the microprocessor, which ensures that each attachment is secure and reliable. ASM AD 8930UV also features a user-friendly interface, allowing operators to control and adjust the die attaching parameters from a single control module. The lateral die alignment feature provides accurate control of die placement, while the die vision system allows for visual inspection of the die and ensures that the die is properly positioned on the microprocessor. AD 8930UV is compatible with a wide range of die sizes and types. It is designed to be highly reliable and durable, with an expected life of at least ten years. Its compact design makes it ideal for use in tight spaces and its rugged construction ensures that it can handle tough tasks. ASM AD 8930UV can be used in any environment, from a laboratory setting to a high-speed production line. With its consistent performance and superior reliability, AD 8930UV is an ideal choice for those who are looking for a reliable and accurate die attacher.
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