Used ASM AD 8930V #293585675 for sale

ASM AD 8930V is a lightweight, high-speed die attacher designed to quickly and securely attach dies to a variety of substrates, including SLP and CSP assemblies. The superior die attach process enables its use in a wide range of applications, including flip chip, direct die attach, power modules, and other substrates that require reliable bond strength. ASM AD8930V is equipped with a versatile multi-function nozzle control unit. It features a non-contact nozzle blowing equipment that provides precise positioning and efficient die lifter operation. The automatic nozzle snapping system eliminates sliding between nozzle tip and die for a secure, repeatable relative bond line. Additionally, the nozzle is equipped with an air exhaust fan that ensures a clean working environment and prevents the bond line from experiencing thermal stress. AD 8930V also offers an advanced flexure operation mode, boosting placement accuracy even further. This mode utilizes flexure control to reduce mechanical stress on components from hard-to-handle analog patterns. Additionally, its unique state-of-the-art vibration control unit accurately manages and protects fragile dies to ensure top quality production. In addition to its advanced capabilities, AD8930V provides unprecedented productivity and accuracy. It boasts an impressive pick-and-place rate of up to 1.5 seconds per die, and an optical bond location machine that enables divergenceless vision. It also offers a three-dimensional bond line sensing technology that automatically adjusts the size of the bond line for a secure attachment. Finally, ASM AD 8930V is a cost-effective and reliable solution for die attachment needs. Its smart design and modular construction guarantee mechanical stability over long-term production cycles, with minimal downtime and maintenance requirements. In addition, the unit features an automated thermal bonding process to reduce operator skill level requirements and improve efficiency.