Used ASM AD 8930V #9268548 for sale

ASM AD 8930V is a die attacher machine designed to supply a high-performance, reliable and reliable interconnecting between chips and leads. ASM AD8930V is capable of handling various-sized dies from 0.50mm to 1.60 mm in diameter with high accuracy and precision. It features a powerful force feedback control equipment to ensure uniform and repeatable results. The user-friendly in-house programming interface simplifies adoption and quickens prototyping operations. The machine is powered by a DC servo motor and a closed-loop force control system which offers the perfect balance between high quality and repeatability. AD 8930V features an adjustable die stuffing range of 0.50mm to 1.60 mm which makes it ideal for attaching more than one die type with high precision. The precise operation is further enhanced by a unique pressure control unit which automatically regulates both the pressure and dwell time. This feature also ensures uniform, repeatable attachment. One of the distinguishing features of AD8930V is its integrated vision machine which provides real-time monitoring of die centering accuracy. Additionally, the machine has an optional ID camera which allows users to control visual locations for each die-attachment. Moreover, ASM AD 8930V has an intuitive touch screen user interface, enabling a quick setup of the machine. ASM AD8930V is fitted with anergonomic and height adjustable operator console that enhances operator comfort and increases productivity. The machine also has an auto-load cycle mode feature which supports a single operator, reducing overall labor cost. Additionally, AD 8930V has a high-capacity magazine which can store up to 600 dies and will automatically reload when empty. The user-friendly design and accessible programming interface make it suitable for prototyping in a wide variety of applications. AD8930V from ASM is an efficient and reliable die attacher for any high-volume, low-cost die-attach operation. It is well-suited for prototyping operations, seamless and uniform connections between chips and leads as well as increased productivity.