Used ASM AD 8930V #9276606 for sale

ASM AD 8930V is a die attacher designed for die-attach process applications in die-bonders, die-bonder systems, chip-bonding systems, and surface-mount technology. It offers robust capabilities for attaching dies to substrate surfaces and other materials. It has been designed with precision and accuracy in mind, enabling quality dies to be attached to standard-size packages with consistent results. ASM AD8930V uses an automated die-attach process to accurately transfer materials such as solder or die-bonding epoxy, adhesive, and flux affinity to a package substrates. The tooling used for this attachment consists of pins and a nose cone support in order to ensure uniform and consistent results. The tooling also helps to reduce overfilling and to regulate the penetration of the plunger when used on soft-shelled packages. The process also allows for a two-step manual adjustment of the tooling during different types of applications. The die-attacher uses a pump that is connected to its electronics to feed the die-attach mixture through its nozzle. The nozzle assembly is designed with a large opening for a wide range of shot volumes and features a hexagonal flow-path design to prevent clogging. The mechanism also ensures that optimal pressure is provided to achieve uniform die-attach dispensation over a range of package thicknesses and substrates. AD 8930V is designed with advanced circuit board components, safety features, and a temperature resistance of up to 250 degrees Celsius. The tool is lightweight and highly portable for easy transportation and storage. It is also designed with user-friendly controls and a convenient touchscreen panel to ensure operator ease. Overall, AD8930V is an efficient and precise tool for die attaching applications. It offers robust capabilities for precision and repeatability, convenient operation, and a reliable and safe construction. This system is suitable for a wide range of die attach processes and applications, making it a great choice for many semiconductor and integrated device fabrication processes.