Used ASM AD 896-IL08 #293610523 for sale

ASM AD 896-IL08 is an automated die attacher specifically designed for the high-precision, speed-critical hit-and-run applications found in many industries. This device is ideal for applications that require attaching components to complexly shaped or textured substrates in a fraction of the time required by manual means. ASM AD896-IL08 is designed to automatically align and adhere components and substrates with extreme accuracy in a highly repeatable process. Its innovative double-beam design ensures accurate die placement - thanks to two separate alignment paths between its two channels - while its vision based substrate recognition and automatic hex alignment capabilities ensure an extremely accurate and repeatable result. The device's dual-channel design provides a range of speed options depending on the application, allowing users to vary the speed of the die bond process from the fastest 'hit-and-run' to 'multi-type' die bounding modes. It also allows for simultaneous bonding for high production rates. AD 896-IL 08 is designed for use with a variety of components and substrates, including metal and die bonded flex circuits, metal and wax epc substrates, and metal substrates. It also offers a range of interchangeable die programs so that users can program their machine for specific requirements. It also provides advanced lighting options and a built-in camera to facilitate optimal die placement. In addition, it includes a range of advanced features, such as an auto-start/stop, data-logging, fault-recovery, and process-improvement functions. All of these features are designed to ensure that the machine provides a reliable, accurate and repeatable assembly process. Overall, ASM AD 896-IL 08 is an innovative and reliable die attacher, specifically designed for high-precision, speed-critical hit-and-run applications. Its dual-beam design, wide range of components/substrates and various speed options, as well as its advanced features all ensure that it can provide a precise, reliable and repeatable die bonding process.