Used ASM AD 896-IL08 #9396967 for sale

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Manufacturer
ASM
Model
AD 896-IL08
ID: 9396967
Die bonder.
ASM AD 896-IL08 is an automated die attacher designed for use in the semiconductor industry. This machine is used to attach small dies to the wafer during production. The machine is equipped with a die picker/placer unit, a vacuum manipulation equipment, a die-pad alignment station, and alignment and pick-and-place optics. The die picker/placer system is capable of both tophand and bottom-hand placements and provides accuracy of +/- 10 microns for die placement accuracy. The vacuum manipulation unit allows for the alignment and handling of multiple die simultaneously and is capable of handling wafer sizes up to 8''. This machine is also equipped with a die-padalignment station that provides simultaneous overlamination of the die onto the wafer and the alignment of the die to the substrate surface. The alignment and pick-and-place optics provide sub micron accuracy for the alignment and placement of the die. The overall performance of this machine is exceptional and is capable of processing up to 8,500 wafers per hour - making it one of the most efficient die attachers on the market today. The user interface is also intuitive and easy to use, providing all necessary controls to allow the user to easily and quickly set up the machine. All in all, this die attacher has several features and benefits that make it well-suited for use in the semiconductor industry.
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